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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 20, 2015

Mark Jelkin, Vice President of Engineering, Hutchinson Technology Inc.

At Speedprint, we anticipate another active year in 2015 as we continue to execute our long term growth plans. In 2014, we hired new personnel in most every area of the business to meet growing demand. 2015 will be the fourth year we have actively promoted Speedprint in the Americas' so we're no longer unknown, and have established a significant installed base of users who serve a variety of markets.

During our 4 years in the Americas', we have established a reputation for outstanding reliability and service which will continue to be the foundation of our success.

We are looking forward to APEX 2015 where Speedprint will introduce new product developments and capabilities for our SP series printers. We'll also show new examples of why the Speedprint design has the lowest operation, maintenance and ownership costs of any printer on the market. These unique features will further add to the value and flexibility within the SP series print platform.
Mark Jelkin
Vice President of Engineering, Hutchinson Technology Incorporated
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling