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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 20, 2015

Doug Dixon, Global Marketing Director, Henkel Electronics Materials, LLC

In 2015, Hutchinson Technology will mark its 50th anniversary. One of the key trends in the electronics industry is miniaturization, and we see that trend continuing in 2015.

Hutchinson Technology Incorporated has been known for over three decades as a leading supplier of electromechanical components to the Hard Disk Drive industry. Year-over-year, we help our customers by providing product solutions that reduce their product form factors while continually adding more functionality to each component. What people may not know is that HTI has been using these same capabilities to enable miniaturization in a variety of other markets, including medical, aerospace, automotive, and mobile devices.

Our fine line circuit manufacturing facility produces components with 15 um lines and 15 um spaces in volumes greater than 500 million circuits per year. We combine that with precision manufacturing capabilities such as stamping, forming, sputtering, laser welding, and micro assembly to offer customers a vertically integrated, "one stop shop" for electromechanical components.

For 2015, we see form factor reduction being an increasingly important requirement in our customer's new product development. One new product we are excited about is our optical image stabilization (OIS) actuator for smartphone cameras. Our OIS actuator is enabling a 10-15% form factor reduction in new camera module designs compared to alternative image stabilization technologies.

We look forward to working closely with our customers in the new year to help them develop and launch innovative products with precision components.
Doug Dixon
Global Marketing Director, Henkel Electronics Materials, LLC
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling