Dave Raby, President/CEO, STI Electronics, Inc.

Henkel continues to invest heavily in new technology development. In 2014, we added significant resource and staff to R&D with an eye on continuing to deliver on our innovation pipeline. For 2015, we will remain committed to growing the organization and look forward to introducing several new products to the market in the coming year.

We are set to make major headlines with a brand new solder materials technology in Q1, build on the award-winning TECNOMELT line of clear, white and chemically-resistant molding materials and continue our leadership in reworkable underfills. Novel positive temperature coefficient (PTC) inks were also introduced in 2014 and these materials are already delivering new efficiencies to flexible heating applications. Henkel's large global footprint, broad materials portfolio and track record as a technology enabler set us apart and help contribute to our customers' success.

Henkel's growth ambitions are well- established and, in 2015, we plan to do all of the above - introduce new products, expand into new markets and hire new employees. With this year's acquisition of leading thermal materials developer, The Bergquist Company, we have already secured a leading position in the thermal management space. We aim to grow the Bergquist business alongside our award-winning semiconductor and assembly materials portfolios, invest resource and unite the expertise of the Bergquist and Henkel teams to develop next-generation thermal products.

Henkel expects moderate industry growth for electronics assembly for 2015. Driven by growth in handhelds, automotive, touch screens and sensors, industry analysts predict a respectable year and continued expansion in emerging markets. For our business specifically, we anticipate a very exciting 2015 as we launch new materials that have the potential to be truly disruptive technologies.