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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 23, 2015

Scott Sober, VP of Quality & Improvements, Saline Lectronics

The electronics market wants, and requires, true integrated solutions. This is the way forward for greater efficiencies and smart factories of the future. Integration is the basis for Industry 4.0 and is at the foundation of what ASM has already begun with our process integration technologies.

Now, with the addition of the leading DEK printing brand to SIPLACE placement technologies, we are the only company with a truly integrated solution and expert process knowledge that spans the entire SMT process. 2015 will no doubt be an exciting year for us as we further develop integrated line solutions and grow the technology portfolios for our best-in-class DEK and SIPLACE products - giving customers infinite choice and collaborating to be Together #1.

In 2015, ASM will expand our business. ASM Assembly Systems' target is growth, which means not just revenue and market share growth, but forward progress in all directions: new high-speed, accuracy and flexibility innovations, new printing solutions, new approaches to the mid-speed market and significant developments in process integration, Industry 4.0 and miniaturization.

2014 has been a very fruitful year for us. ASM's SIPLACE business made significant gains in all regions and ASM Pacific Technology (ASMPT) acquired the leading printing technology company, DEK. With the expanded organization, we expect 2015 to be another successful year for ASM Assembly Systems and our customers.

While we anticipate stability for the market, we project ASM to continue to gain market share as we enable our customers' businesses with even more capability and move even closer to our objective of being #1 in the electronics market by 2016.
Scott Sober
VP of Quality and Continuous Improvements, Saline Lectronics
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling