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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 26, 2015

Anthony Ambrose, President & CEO, Data I/O Corporation

As predicted at the beginning of this year, Saline Lectronics experienced tremendous growth in 2014. We have been fortunate enough to grow with our core customers while simultaneously developing new relationships with additional clients.

We have been challenged with unique, complex technological requirements and even tighter, aggressive delivery schedules. We have risen to the occasion on so many of these opportunities and learned invaluable lessons along the way. And while this growth has been exciting and positive, it has definitely come with a new set of challenges forcing us to look inward at our current manufacturing model.

As we plan to continue this exponential growth, it's important that we return to the basics of manufacturing. Reshoring continues to become a reality for US manufacturers, and as more manufacturing work returns to the US, we are challenged to exceed the capabilities of our foreign competition.

Saline Lectronics' formula for success in 2015 is actually quite simple--hiring and developing talented staff, creating solid, repeatable core processes and procedures all while keeping tomorrow at top of mind. In essence, we are laying strong, dependable tracks for our train to follow successfully through 2015.

Without the proper tracks in place, no matter how strong and powerful the engine, the manufacturing train will have nowhere to go. It is our hope that these new tracks will drive our train to the front of the electronics manufacturing industry.
Anthony Ambrose
President & CEO, Data I/O Corporation
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling