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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 26, 2015

Jim Lin, Vice President of Sales, Test Research, Inc.

2014 was a banner year for Data I/O, the worldwide leader in device programming. Data I/O's growth and return to profitability were driven primarily by our new PSV7000 programming system and customers in the automotive infotainment and industrial/internet-of-things markets. The PSV7000 delivers the velocity, versatility and superior value for the lowest total cost of programming.

In 2015, industry trends are positive for programming. We see a continued growth in the files sizes programmed during manufacturing. We also see continued push for smaller parts handling and security. Quality concerns and increased labor costs will prompt customers to move from manual to automated programming globally. Trends to onshore manufacturing and program internally will also continue.

Data I/O will continue to build on our momentum from 2014 with relentless focus to deliver programming solutions that are more cost effective, easier to use, and more secure.
Jim Lin
VP of Sales, Test Research, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling