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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 27, 2015

Erhard Hofmann, Managing Director, AdoptSMT

TRI has been closely following the diverse technological developments in electronics manufacturing on around the globe. While the bulk of EMS business in 2014 took place in China and South East Asia, a significant number of low-volume, high-mix productions have been emerging in developed economies and focusing on products with high added value and customization options. These customers have markedly different requirements for testing and inspection, and TRI is making sure our new products are ready to satisfy their needs.

In the last two years, we have seen a large surge in mobile devices, which have driven the demand for high volume production across the Asian market. We can foresee two new trends replacing mobile technology as the highest-growing segment: automotive electronics and wearable & connected electronics.

Driven by rising popularity of electric and hybrid cars, as well as driving assistant technologies and in-car entertainment, we expect the automotive electronics segment to enjoy rapid growth for the following 10 years, particularly in developed markets across the US and Europe.

Wearable and connected electronics have a strong potential - bringing smart automation and connectivity to everyday appliances. Despite many technical and security issues, we believe this emerging technology will be the next growth driver in the future of high volume electronics.

TRI's new generation of testing and inspection solutions focus on these growing markets with new technologies, including advanced 3D inspection and parallel testing while maximizing cost-performance value for our customers. With a clear idea of future developments, we aim to remain a strong and reliable partner for all testing and inspection in the EMS industry.
Erhard Hofmann
Managing Director, AdoptSMT
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling