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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 28, 2015

Henk Biemans, Managing Director, Mek Europe BV & Mek Americas LLC

We expect 2015 to be the year in which shop floor digitalization gains momentum.

With the increasing amounts of data flowing between and within the design and manufacturing processes and with the re-emerging trend of on-shore manufacturing, initiatives such as Industry 4.0 and concepts such as the Internet of Things gained popularity this year.

We feel that there is a true need for delivery of complete and verified design data to fabrication and manufacturing, and delivery of normalized, real-time performance, consumption, and quality data from the manufacturing floor to ERP, PLM, and supply-chain systems.

Our focus has been to deliver solutions that address these needs, and we will continue to support and develop those areas in 2015. Our proven capabilities in delivery, acquisition, and standardization of data throughout the design and manufacturing flows will be what differentiates Mentor Graphics.

Henk Biemans
Managing Director, Mek Europe BV & Mek Americas LLC

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura