Wilson Fung, AVP, Reed Exhibitions

Our main differentiator will continue to be our offering for dedicated AOI for bottom up or combined top down-bottom up inspection for THT in Wave and Selected soldering processes of Power Electronics PCBA. The base of this system is the SpectorBOX Modular AOI.

2D AOI with height measurement or topographical capabilities, mostly referred to as 3D AOI, will gradually evolve as a function in AOI. Mek obviously follows this trend throughout its range.

We will be working in co-operation with market leading system integrators and handling systems suppliers.
From a service point of view we will aim to offer increased emphasis on online support systems allowing customers 24/7 access to support systems.

Our market is likely to expand as a result of the growing awareness that AOI has a role not only in SMD based PCBA, but increasingly for THT in Power Electronics. Power Electronics are closely related with Wave, Manual and Selective Soldering processes.

Mechanical and soldering defects in Power Electronics involve higher risks for human casualties. These can be reduced by the application of AOI.

Using AOI for QA follows the trend of reduced human intervention in PE manufacturing soldering processes by e.g. Selective soldering technology.

We will be developing a stronger US presence through the expansion of Mek Americas organizational network.

2014 brought us 20% growth and this trend is expected to continue in 2015, especially in THT AOI and 3D technology (can be combined).