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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 2, 2015

Ernie Grice, Vice President of Sales, Kurtz Ersa North America

I would like to thank all our customers for their support in 2014.

2014 was again a record year for Digitaltest in North America, with growth in excess of 100%.

Moving into 2015 we still expect good growth in the electronics manufacturing industry for Digitaltest. Reviewing leading indicators, such as the PCB Book-to-Bill numbers, the end of the year numbers for 2014 showed a good upturn moving into 2015, and we expect this to continue through the year.

We have also seen continued market share growth coming from customers who have used lower performance test systems. These customers are looking for test solutions that can improve test quality and productivity. Significantly the need for enhanced test techniques, probing accuracy and the fast programming provided by Digitaltest's test solutions are allowing us to meet customer's current and future requirements.

In 2015 we plan to raise the bar further as we continue to enhance our test capabilities with new innovative test solutions and programming enhancements. In addition, we will continue to strive, to provide, the best customer support for the North America market.

We also look forward to seeing you at the 2015 IPC APEX Expo in February, where you will be able to see our latest flying probe, in-circuit, functional test solutions and production software solutions in action.
Ernie Grice
Vice President of Sales, Kurtz Ersa North America
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling