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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 4, 2015

Tetsuro Nishimura, President, Nihon Superior Co. Ltd.

2014 was a great year for March, but we had to shift our priority from technology and product development to manufacturing. With the start of 2015, we are back on course, even if slightly behind schedule.

On the PCB side, flexible circuits, used in numerous small electronics, is still the strong driver of the market. However, we are already starting to see a comeback from the high density multi-layer boards that are used in the server market. This growth could be related to more and more mobile/portable devices using cloud-based storage and applications. Expectations from customers are more capacity and greater uniformity, around 85%.

Any engineer can tell you that a batch system reaching 85% is a difficult challenge, so March is working on new electrode designs and gas distributions to allow our batch plasma systems to have higher etch rates, while delivering uniformity above the customer's expectation.
Tetsuro Nishimura
President, Nihon Superior Co. Ltd.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling