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February 5, 2015
Stephen Garcia, President, Bay Area Circuits, Inc.
The 15-year track record of reliable service that has been delivered by its SN100C(R) alloy established for Nihon Superior a reputation for formulating reliable cost-effective lead-free solder. The status of SN100C as a widely-used lead-free solder has now been recognized by its listing in the international standard ISO 9543. We believe this will result in even further growth as users continue to look for a recognized alternativs to expensive silver-containing solders.. Nihon Superior's tradition of innovation continues in 2015 with the introduction of new lead-free joining materials for reliable service in harsh environments such as automotive and power management. A lead-free solder for joining aluminum, AUSAC-35 opens up new opportunities for replacing copper with aluminum, which can deliver equivalent electrical conductivity at a lower cost and with less weight. The AlcoNano(R) sinterable silver provides an alternative to lead-based high melting point solder in applications such as die attach in power semiconductor packaging. To strengthen the service it can provide in South East Asia Nihon Superior has opened a new regional headquarters in Kuala Lumpur, Nihon Superior Asia Sdn Bhd.
Stephen Garcia
President, Bay Area Circuits, Inc.
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