Mo Ohady, General Manager, Digicom Electronics

Finetech has been a market leader of rework systems for more than 20 years. Our thermal management and placement accuracy was considered "overkill" years ago, but technology miniaturization and board density demands have reached a level that now require these capabilities. We have continued to enhance our product line and capabilities throughout 2014.

In March of 2014, Finetech broke ground on a new 60,000 sq. ft. state-of-the-art production and development center in Berlin, Germany. This nearly 8 million Euro investment is a strong commitment to Finetech's continued growth. The new eco-friendly facility will position us for expansion in R&D, product engineering, applications, and support staff for many years to come. Our customers will benefit from the expanded ISO Class 6 cleanroom space for special assembly and application work. As we open the new facility in early 2015, we look forward to introducing new ideas and technology to the market.

We see the demand for rework of extremely small components becoming more mainstream in 2015. For many years we have shown a complete rework solution for 01005 passives. We are now showing a solution for 008004 components. Yes, that is even smaller than 01005 components! We expect to see this with more flip chip style packages being integrated into PCB's. In 2015, we are better positioned than ever to deliver world class solutions.