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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 6, 2015

Rick Jordan, TS&D Director, Cytec Industries Inc.

Digicom is bulldozing its way into 2015, literally. Three years ago we moved into a new facility in Oakland, California and are now expanding into the other side of the building. The new offices and enlarged manufacturing floor will be opening at the end of February.

We have increased capabilities and capacity in all areas, especially for production of medical devices, military/aerospace products, sensors, industrial products, and complex boards and assemblies. New pick-and-place, selective soldering, and inspection equipment have been added to handle emerging technologies, quick changeover from leaded to RoHS compliant products, and to maintain the high quality found in our Diamond Track manufacturing processes.

Our cleaning process continually pushes for even higher standards of clean to ensure 0% failure due to contaminated boards. We just hired new personnel and will be hiring more to support production and customer support. We invite everyone to visit our new facility.
Rick Jordan
TS&D Director, Cytec Industries Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling