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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 9, 2015

Markus Wilkens, President, ASYS Group Americas Inc.

In 2015, Cytec envisions energy efficiency, cost reduction and product reliability to remain the key focus areas for the electronic power management industry.

With the continuing growth of the global population and energy resources becoming limited, energy consumption will continue to be at the highest priorities across many industries. The implementation of government regulations will make it compulsory for electronic design engineers to increase the efficiency of both power generation and power management devices.

Electronic designs will need to balance the demand for innovation with stringent cost requirements, along with even higher expectations on end-product reliability, thermal management and low outgassing to help positively enhance and lengthen the overall product life cycle.

Cytec's Formulated Resins team of industry and technical professionals is looking forward to continue ensuring customers in overcoming these challenges in 2015 through its formulation expertise, customer engagement and high reliability electronic insulation solutions.
Markus Wilkens
President, ASYS Group Americas Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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