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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 10, 2015

Dr. Tamim P. Sidiki, Global Marketing Director, DSM Engineering Plastics

One of ACE's greatest differentiators is that from our inception we've continued to deliver new technologies that have advanced the selective soldering process.

Among our newest innovations is the development of a revolutionary new graphics-based programming software enabling graphical monitoring of the entire selective soldering process, automatic fiducial alignment with single click teach capability, and the world's only fully maintainable drop-jet fluxer that can dispense water-soluble, rosin-based and high solids content flux chemistries.

We are proud that we continue to deliver exceptional value to our customers by offering automatic fiducial alignment, board warp compensation, on-machine help videos, and remote machine diagnostics capabilities as standard features at no additional cost.

Throughout the coming year we will maintain our strong investment in R&D so we can continue our reputation of delivering award winning technology, and we plan to continue our highly successful series of selective soldering workshops, to help solve our customer's most challenging selective soldering processing needs.

Our expectation for 2015 remains strong since the demand for selective soldering technology remains strong into the foreseeable future. In addition, 2015 marks the milestone of being the tenth year ACE Production Technologies has been serving the needs of the molten soldering application business.
Dr. Tamim P. Sidiki
Global Marketing Director Electronics, DSM Engineering Plastics BV
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling