Satoshi (John) Otake, Deputy General Manager, SAKI America Inc.

Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection. One of the critical issues in measurement accuracy revolves around reflection-based distortions in solder joint measurement. Our R&D experts championed a breakthrough solution that addresses this challenge.

CyberOptics developed a breakthrough 3D sensor that is incorporated into the new SQ3000 3D AOI system launching this year. The sensor has a combination of attributes that differentiates it from competing solutions.

The unique structural architecture of the sensor itself enables a speed advantage and the sophisticated algorithms, namely, the Multi-Reflection Suppression (MRS) and fusing algorithms enable a highly accurate and precise 3D representation. The resulting benefit is the ability to achieve microscopic image quality at production speed. This combination has been unachieved until now.

We're focused on helping electronic assembly manufacturers drive improvements in process, quality and operational efficiency and we're also focused on leveraging this technology into back-end semiconductor and 3D scanning for general purpose metrology, two other market segments we participate in that have a need for high-precision inspection.