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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 19, 2018

Pamela J. Gordon, Senior Consultant, Antea® Group

This past year Balver Zinn have invested more into R&D -- with Robots being an increasing footprint in our environment also customer pressure to reduce cost of soldering materials -- Balver Zinn R&D have focused on new products to meet these demands.

Balver Zinn has developed a wider range of core wire to meet the rising demand of robotic equipment and have tailored specific materials for certain robotic equipment.

Low manufacturing cost is always a customer goal and to this end Balve Zinn in conjunction with Nihon Superior have introduced SN100CV® into the European Market as an alternative for SAC solder paste.

For nearly 18 years Balver Zinn in partnership with Nihon Superior we have introduced SN100C® as a low cost alternative to SAC solder, and SN100C® is now a familiar trade name used across many industry platforms -- together we will continue to listen to customer needs and invest in the future.
Pamela J. Gordon
Senior Consultant, Antea° Group
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling