circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 24, 2018

Mike Jones, Vice President, MicroCare Corporation

I am a little sad to turn the calendar from 2017 because it was such a great year for Circuit Technology's training business. We were up at all four training centers-MD, NC, FL and Costa Rica as well as our on-site training at customers.

It was a record year where we saw growth in our core IPC training business and growth in our custom curriculum such as SMT Boot Camp, 1-day soldering workshops and BGA Rework. Our customers are seeing real value and ROI in properly training their workforce. We also trained more than 1,000 students in 2017.

Thanks to all our loyal customers! As I look forward to 2018, it will be hard to top 2017 but I am optimistic because most of my customers I have talked to are optimistic. They are planning to grow and they are planning to schedule more training. Because of this, I have hired another trainer to handle the growth.

I am very happy with the team of trainers we have, the training centers are all updated with state of the art equipment and our customers have already booked training in 2018.

I look forward to another great year!
Mike Jones
Vice President, MicroCare Corporation
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling