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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 30, 2018

Terry Buck, President, Amerway, Inc.

Coming off of a record-breaking year that further validated our approach, ECD continues to maintain our core philosophy of complexity-reducing innovation, which has fueled development of differentiated technology for over half a century.

Solving complex challenges with practical solutions drives the ECD team, who are trusted experts sought out for counsel on thermal processing and dry storage best practices.

Always thinking beyond current requirements with an eye toward future capabilities, ECD's latest initiative leverages our thermal profiling leadership and soldering process knowledge to deliver a new, adaptive and scalable solution for dynamic environments. An evolution in hardware and software, the novel technology recognizes market ambitions for total automation and goes beyond current Industry 4.0 standards.

This continuous process monitoring system answers the call for automated oversight and pre-emptive optimization, while also building in the critical component of verification -- which is essential for high-yield outcomes.

Adding OvenSENTINEL™ to our award-winning electronics portfolio of M.O.L.E.® and SmartDRY™ solutions will deliver next-generation capability to our customers today.
Terry Buck
President, Amerway, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling