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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 31, 2018

Roberto Yebra, Technology, Marketing Specialist, Test Research, Inc.

We laid the groundwork for a successful 2018 with accomplishments that included achieving ISO 9001 certification. Now we're ready for strong growth. We've expanded our facility with an additional 25,000 square feet of manufacturing space, and are working with various partners to broaden our products and services offerings.

With our planned expansion completed, plus an uncompromising dedication to the highest levels of customer support, we expect to continue to gain market share especially with the strong re-shoring trend in the industry. As a domestic manufacturer of solders located in Altoona, Pennsylvania, we're ideally positioned to serve our U.S. and adjacent international customers in Canada and Mexico.

Our customers can drive to our facility, and we can likewise easily visit them to determine their needs, solve their soldering problems, and work with them to deliver the right alloy or customized solution. We manufacture our alloys right here, giving us a significant advantage over distant offshore suppliers.
Roberto Yebra
Technology and Marketing Specialist, Test Research, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling