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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 1, 2018

George Babka, Sales General Manager, Yamaha Motor Corp, USA

2017 saw the rise of several standards and protocols to suffice the gap in the SMT Industry regarding Industry 4.0.

Every company wants to take a part of Industry 4.0 as if it was a sole market that one company can satisfy all their needs. Only a few are able to deploy their product line and deliver a satisfactory M2M communication with metrology, guided by the principles of IoT.

Partnerships between SMT core corporations and the other third parties systems are inevitable. Thanks to the development of projects such as ASM's the Hermes standard and Fuji's ELF standard, interconnected digital factories are now a reality.

As we move into 2018 TRI's focus is to cooperate with such projects and deliver leading technologies. Driven by the ever-changing industry, we have prepared higher resolution Inspection for the rising wearable devices, flexible PCBA, and automotive tech.

The high demand for miniaturized devices and chips fuels the need for a reliable SMT Inspection System in which you need to compromise output or quality. However, a balance can be achieved with a correct assessment. At TRI it is paramount to satisfy our customers' requirements to help them maximize their production yield and optimize quality management.
George Babka
Sales General Manager, Yamaha Motor Corporation, USA
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling