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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 2, 2018

Anthony Ambrose, President & CEO, Data I/O Corporation

Look for YAMAHA to move briskly ahead in 2018 with additional Machine to Machine (M2M) Solutions for Factory 4.0 and updates to existing machines, expanding component range and speed.

Advancements in automated feeder technology, 3-D MID assembly, alignment tolerance and throughput will dramatically improve our already robust machine offerings. Many of these new technologies will be on display at IPC/APEX Expo 2018 in Booth #2333.

Additionally, our new state of the art factory in Hamamatsu has significantly improved synergies across all of our product lines, and has already increased production capacity by 50% to meet increasing demands for machines worldwide. The further integration of iPulse and Sigma Engineering into Yamaha's core engineering groups enables us to develop new and customized solutions more rapidly, matching the increased pace of technology innovation.

Stay tuned for several new product releases and updates in 2018 that will further expand our SMT Portfolio, delivering a true Total Line Solution to our customers.
Anthony Ambrose
President & CEO, Data I/O Corporation
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling