Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

February 6, 2018

Terry Heilman, CEO, Sunstone Circuits

ResinLab provides standard and custom products to almost every industry for electronic packaging, as well as general industrial, OEM and product assembly markets.

We have designed new products specifically for the new Moldman Mix on Demand system, with many allowing cycle times of under 2 minutes. Traditional potting and encapsulation of printed circuit board (PCB) and electronics assemblies requires a container significantly larger than the components, and an encapsulant material that fills that container while meeting the demands of the application.

The Moldman Mix on Demand system eliminates the need for the container, and streamlines the profile of the encapsulant over the PCB and assembly. The result is a sleeker looking finished part that is lower in weight because less encapsulant material needs to be used. This technology is a step change from potting and encapsulation.

Terry Heilman
CEO, Sunstone Circuits

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura