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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 9, 2018

Alan Abbate, Vice President, Multek

With another record year in 2017, INGUN continues to grow in 2018 and is prepared for the SMART-Era; or let's call it "SMART-IoT-Automation-World" to cover all the new technology trends which are in full swing and will dominate the Electronics Industry.

To ensure our growth path and to optimize our local customer support throughout the US and Canada, INGUN USA is hiring additional Regional Sales Managers for the West Coast and Mid West region.

With our strong expertise in the ATE arena and additional man power, INGUN USA continues its successful path and, as in 2017, we are still very much excited to be in touch with all the new technologies in the SMART-Everything-World.
Alan Abbate
Vice President High Reliability Solutions, Industrial & Emerging Industries, Multek
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling