François Monette, Chief Sales & Marketing Officer, Cogiscan Inc.

2017 was a year of growth for Multek, a leading supplier of Interconnect Solutions ranging from single sided Flexible Printed Circuits to 46 Layer High Density Interconnect (HDI) rigid printed circuit boards and we see 2018 as another growth year as we continue to collaborate with our customers on innovative new products.

Multek's focus on Manufacturing Excellence, Technology Leadership, Best-In-Class Customer Service and Supply Chain Optimization, deeply rooted in our core values and driven by our greatest asset, our people, has positioned us to support the ongoing evolution of new technologies emerging in our markets.

Multek has established a leadership position by engaging early with our Customers through our Interconnect Technology Centers (ITC's) and our global network of Field Application Engineers (FAE's).

Our ITC labs in Zhuhai, China, and San Jose, California, ensure our Customers' products have World Class Reliability -- by proactively addressing things like Mechanical Integrity, Thermal Management and Signal Integrity. Our FAE Team provides up-front Engineering support and collaborates hand-in-hand with our Customers on their future needs.

Whether it is the IoT, Virtual Reality, Augmented Reality, RF, SiP or 5G, Multek is helping Customers connect the world in ways never before seen. The industry trends of miniaturization, increased density, speed and thermal management that we saw in 2017 will continue to drive our manufacturing focus in 2018.

Multek is an industry leader in many HDI technologies like ELIC (Every Layer Interconnect) copper filled stacked microvias and Thermal Management through the use of Embedded, Attached or Pressfit Coins and our investment strategy for 2018 will propel us into a very successful future.