circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 13, 2018

Brian Czaplicki, Director, Air-Vac Engineering Company, Inc.

In 2018 we will continue to solidify our position as the industry leader for connectivity solutions. Our number one challenge is to grow our organization to maximize the current market opportunity driven by Industry 4.0 and IIoT.

Since the timing is now we have a very aggressive business plan and we are adding the resources to execute this plan while maintaining the highest level of customer satisfaction that made our reputation over the past 18 years.

We plan to stay 100% focused on electronics manufacturing since our added value is based on our deep domain expertise and strong partnerships with leading vendors in our industry.

Together with our strategic partners we put together a very exciting development roadmap to enable the factory of the future. For obvious reasons we cannot announce these new products until they are released but you can expect significant innovations to be introduced by Cogiscan and its partners in 2018.

The electronics manufacturing industry is facing increasing challenges. In addition to the usual pressure on cost, quality and delivery, manufacturers are now expected to digitalize and integrate their operations as part of the overall product life cycle, from cradle to grave. This requires a significant shift in thinking and a strong connectivity platform and Cogiscan will play a significant role in this process.
Brian Czaplicki
Director: Marketing & Sales and Management Team Member, Air-Vac Engineering Company, Inc.
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling