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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 22, 2018

Ron Jakeman, Managing Director, Electrolube

Henkel's electronics business enjoyed a historic 2017, having launched over 50 new products and logging record sales. With electronics market growth projections for 2018 around 4%, on average, we anticipate another successful year. Henkel's electronics innovation achievements, however, are due to more than overall market expansion alone.

Our broad materials product range -- across the spectrum of electronics assembly and semiconductor packaging -- and ability to develop holistic, compatible material approaches for entire systems, not just a single element, has driven solid partnerships with many of the world's top manufacturers. This is true for multiple market sectors; automotive is a case-in-point.

Here, Henkel's comprehensive product offering is enabling challenging performance metrics for new energy vehicle (NEV) lithium-ion battery systems. From board-level interconnect and protection to thermal management materials, our complementary solutions can be found in the battery cell, module and pack.

Henkel expects another prolific product development year, as miniaturization continues to dominate the electronics landscape, shifting assembly requirements in terms of processability, performance and long-term reliability. New approaches to material deposition like solder jetting, for example, robust thermal management capability and material compatibility considerations will become increasingly important for next-generation designs.
Ron Jakeman
Managing Director, Electrolube
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling