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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
March 1, 2018

Robert Conway, Executive Chairman, Blakell Europlacer Group

In 2018, CeTaQ GmbH will celebrate its 22nd year providing the electronics industry with state of the art Cpk measurement solutions. While companies are still embracing 6-Sigma methods; SMT manufacturing continues to benefit from regular equipment validation exercises. As a result, increased manufacturing efficiency, additional capacity and defect reduction in each process step becomes intrinsic!

As Independent Capability Analysis Experts supporting the worldwide electronics industry, CeTaQ provides on-site mobile measurement solutions for equipment performance validation. Whether you're an OEM looking to check your specs or the end user needing the highest level of accuracy for complex SMT manufacturing, CeTaQ measures it.

CeTaQ Americas, celebrating 17 years with CeTaQ GmbH in 2018, hired Omar Calderon in Feb 2017 to support growing client activity in Latin America. This contributed to 20% YoY financial growth in the Americas region and we look to hire a new Systems Engineer to help support the entire territory. CeTaQ Americas will exhibit at IPC APEX Expo in Booth #3208.

Recent developments:
1. The German Accreditation Body (DAkkS) hereby confirms that the testing laboratory CeTaQ GmbH At Promigberg l, 01108 Dresden has completed competency requirements according to DIN EN ISO / IEC 17025: 2005 to perform examinations in the following areas: Checking the positioning accuracy of SMT systems with the help of an optical 2-D measurement system. This accreditation brings a higher level of commitment to measurement and quality improvement standards for CeTaQ's unparalleled industry position.

2. Major solder paste inspection (SPI) manufacturers are embracing CeTaQ's 3-D etched glass artifact to validate equipment performance. Following typical metrology guidelines, the SPI systems X, Y, Area, Height and Volume quality characteristics are validated for compliance to specifications. Are you validating your quality measurement tool?
Robert Conway
Executive Chairman, Blakell Europlacer Group
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling