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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
March 8, 2018

Allen Duck, VP of Sales & Marketing, Getech

As the recently formed selective soldering division of Nordson Corporation, Nordson SELECT is continuing to combine the features of both ACE Production Technologies and InterSelect GmbH to deliver the best of both worlds to our worldwide customers. For example, our drop-jet fluxer is capable of handling high solids content fluxes and is highly maintainable which is not the case with most competitors on the market.

We have a big advantage in how we image and program a board using fiducial recognition cameras plus our single user interface software allows worldwide program mobility across multiple machine platforms. This means customers can create programs at one location and deploy them to other global sites enabling rapid reconfiguration of selective soldering lines for increased manufacturing flexibility.

Unlike other solder nozzle cleaning systems, our patent pending automatic solder nozzle tinning system does not spray a liquid or powdered flux. It keeps our solder nozzles clean by removing oxidation residues and re-tinning the nozzle surface without overspray or contamination of the board or the machine.

Throughout 2018 we will continue our commitment to deliver innovative products, outstanding service and exceptional value to our growing worldwide customer base, all backed by Nordson's award-winning global support network.
Allen Duck
VP of Sales & Marketing, Getech
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling