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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 2, 2019

François Monette, Chief Sales & Marketing Officer, Cogiscan Inc.

2017 lived up to expectations. The global economy continues to make gains across every industry and electronics remains one of the most exciting. Consumers are embracing the "internet of things" (IoT) with industry and home automation gaining widespread implementation. The autonomous vehicle has leapt from the pages of science fiction and is being tested throughout the world.

Electronics in medical devices continue to give healthcare providers more treatment options and better outcomes and LED lighting has become cost effective and ubiquitous. Common to all of these applications are more compact and more powerful electronics, putting increasing demands on the materials used in the assembly process.

Released in early 2017, AIM REL22™ and REL61™ alloys provide assemblers with solder alloy options that can improve product reliability, ease production challenges and reduce costs. The data on the performance of REL22 alloy is nothing short of remarkable. REL22 has already established itself as the preferred alloy for applications requiring improved thermal cycling and mechanical performance.

Automotive OEM suppliers and high power LED manufacturers are recommending the material to their EMS providers as a solution to some of the shortcomings of SAC305. REL61 gives assemblers in cost sensitive applications a material that can be processed at a lower temperature; reduce costs with no reduction in soldering performance or reliability versus other low/no silver alloys. The combination of REL22 and REL61 provide the PCB assembly industry with new tools to address current and future requirements of an ever evolving industry.
François Monette
Chief Sales & Marketing Officer, Cogiscan Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling