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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 3, 2019

Ed McMahon, CEO, Epec Engineered Technologies

Cogiscan occupies a unique position in the industry as we bridge the gap between the shop floor and enterprise systems to enable digital transformation of the electronics industry. History has shown that the electronics assembly process is too complex to be managed with a single integrated software system. The factory of the future will be achieved by combining several best-in-class applications from different vendors and we facilitate this integration.

2019 will be a big year for several reasons at Cogiscan. First, we will celebrate our 20th year of technology innovation. This will coincide with the release of several new products that will have a significant impact for our customers and partners. This includes new hardware and software products that will improve visibility, connectivity and overall performance of all assets on the production floor.

We strongly believe that data collection and data management are the keys to unleash the full potential of Industry 4.0. The challenge remains to implement practical working solutions in a fast-changing environment while remaining open to future development. Our Co-NECT multi-protocol bidirectional machine interface is a great example of a robust, practical and future-proof technology.
Ed McMahon
CEO, Epec Engineered Technologies
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling