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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 4, 2019

Gary Goldberg, Founder, PROMATION, Inc.

The business climate in 2019 will be filled with uncertainty. One thing that is certain is that in order to succeed in any business climate you need to invest in new technologies and products to differentiate your company.

Here at Epec, our strategy will include adding more design resources and tools which will allow us to work more efficiently with our customers so that they can get their new products to market quickly. In the electronics hardware industry speed is crucial so we must invest in people and systems to provide this service.

As part of our product technology roadmap, we will be expanding our RF products and introducing RF coaxial cable assemblies to go along with our diplexers and multiplexers, along with expanding our online flex/rigid flex PCB portal InstantFlexQuote to give customers the ability to get their own quotes and place orders quickly on-line.

So, while growth in 2019 may be challenging, it doesn't change how companies will win.
Gary Goldberg
Founder, PROMATION, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling