Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 8, 2019

Martin Hart, CEO, TopLine

2018 has been an exciting year for Plasma Etch; we continue to see strong demand for the patented gasless etching technology in our Mark II line of plasma systems.

This gasless technology allows our customers to etch and desmear without CF4 gas. The environmental benefits and cost savings of this technology have proven to be beneficial for a variety of etching applications.

We expect gasless etching enabled product lines to drive large system sales in 2019.

Plasma Etch will once again be demonstrating a PE-25 and a Plasma Wand at MD&M West and IPC Apex this winter. Later in 2019, we will be demonstrating our vacuum and atmospheric plasma systems at MD&M East in June and Semicon West in July. We would love to see everyone at a trade show.

Thank you to all of our customers for the continued support as our industry enjoys exciting growth.

Martin Hart
CEO, TopLine

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura