Steve Zweig, Vice President of Sales, Glenbrook Technologies Inc.

2019 will be a growth year for TopLine, marked by increasing customer interest in our Column Grid Array (CCGA) technology. This is because CCGA provides more reliability than BGA for harsh environments where there is typically CTE mismatch between large ceramic IC packages and the PC Board. CCGA packages are made with non-collapsible solder columns for surface mount soldering on Printed Circuit Boards (PCBs) and provide more compliancy than BGAs to absorb stress and increase solder joint reliability.

During 2018, TopLine worked to advance technology and contribute to process development, in one example, by completing the acquisition of Daisy Chain Flip Chip Test Wafers from General Motors Components Holdings, LLC (GMCH). Daisy chain components are essential for evaluation and developmental applications including placement and solder practice, as well as underfill experiments and life-cycle testing. Thanks to this acquisition, TopLine can provide daisy chain test die to a wide range of customers who will be doing developmental work.

TopLine also completed the acquisition of a 4-acre plot of land for expansion and outreach to young engineers in the educational community in the college town of Milledgeville, Georgia, located approximately 100 miles from Hartsfield-Jackson Atlanta International Airport (ATL), the nation's busiest airport.

There is increasing customer interest in copper pillar attachment to silicon die and to semiconductor packages. TopLine will increase our manufacturing capacity in 2019 for copper pillar interconnects for fine pitch IC array packages up to 10,000 pins. Copper pillars are available in a variety of sizes with different plating to match packaging requirements.

We also recently announced the availability of new low-void solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.

TopLine manufactures a wide range of Daisy Chain test components, Column Grid Arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.