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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 15, 2019

Carlos Bouras, General Manager, Nordson SELECT

Solderstar celebrated its 18 year of trading in 2018, and has seen another year of growth, with increasing opportunities a result of both product and market development.

Our products continue to be well received in all geographic sectors, with project growth due to continuing investment in the tools and software required to improve their process control.

Many of Solderstar's customer base are looking at gaining quality improvements and increased customer confidence, through diligent checking of their thermal process.

We at Solderstar are striving with our development to make that procedure as simple and cost effective as possible.

A number of industry initiatives such as CFX and Hermes will undoubtably help with tying all this production data together, providing the potential for more tightly controlled production processes and ultimately smarter machines.

Our continued commitment to product improvement and development, plus embracing the latest software technologies will see new product launches at IPC Apex 2019, SMT Nuremberg and Productronica in 2019.
Carlos Bouras
General Manager, Nordson SELECT
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling