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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 16, 2019

Todd O'Neil, VP Business Development, Optical Control

Nordson SELECT has completed a very successful 2018 delivering a wide range of award-winning selective soldering technologies to our growing base of worldwide customers. At the same time our expanded international sales, applications and support team is well positioned to serve ever challenging customer applications throughout Asia, Europe and the Americas.

Our new dual solder pot systems can solder two PCBs in a parallel mode without the need to be in a panel or palletized allowing the machine to process two boards at the same time. Likewise, our new compact in-line selective soldering platform with combined fluxing, preheating and soldering ideal for small batch production requirements is rapidly gaining traction in the market.

Unlike other solder nozzle cleaning systems, our patent pending automatic solder nozzle tinning systems do not spray an adipic acid or a liquid or powdered flux. Both our flux core wire or flux gel systems do an exceptional job of keeping our solder nozzles clean by removing oxidation residues and re-tinning the nozzle surface without overspray or contamination.

In 2019 we will continue our commitment to deliver highly innovative products, together with outstanding service and exceptional value to our growing worldwide customer base, all backed by Nordson's global support network.
Todd O'Neil
VP Business Development, Optical Control
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling