Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 18, 2019

Terry Buck, President, Amerway, Inc.

With another record year in 2018 and great additions to our national sales team, INGUN USA is continues its mission and bring highest quality and best customer service to the Electronic Industry.

A very important topic for 2019 is 5G Technology where INGUN is striving to set new standards in the test world of electronics manufacturing.

Our brand-new product called E-Type Fusion® will set the new standard for challenging contacting of tough OSP coatings, lead-free soldering, or contaminated printed circuit boards (PCBs). Despite harsh conditions, these probes achieve outstanding test results by applying features like "Aggressive tip styles", "Robust plating", and "Increased spring pre-load".

We look forward to all the new exciting projects our customers will challenge and trust us.

Terry Buck
President, Amerway, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura