Lawrence Davis, President, Advanced Assembly

Saki investment in new technology, new equipment, and partnerships for M2M communication and connectivity will continue to be its focus in 2019. This includes transparency of equipment operation and processes so machines can work in sync and defect-free products can be produced with the speed and throughput necessary for today's marketplace.

Saki 3D SPI and AOI machines program themselves, diagnose maintenance cycles, make changes to the inspection process, alert other equipment in the assembly line to make adjustments, and deliver data on-the-fly to provide self-supporting inspection and assembly processes. At the same time, Saki continues to ensure absolute precision, stability, and long-term reliability from its 3D SPI, AOI, and AXI platforms and hardware to guarantee that the data passed on to other equipment and processes is accurate.

Saki recently introduced bottom-side AOI inspection that takes advantage of Saki's proprietary and long-proven 2D line-scan technology. 2D line-scan is more cost-effective and faster than 3D inspection for automatic pin through-hole fillet inspection after selective and wave soldering.

We also see increasing applications in the semiconductor industry for Saki's 3D AXI systems with planar computer tomography technology for inspection and measurement of insulated gate bipolar transistors (IGBTs) and land grid arrays (LGAs).