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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 8, 2019

Milan Shah, President, Royal Circuit Solutions, Inc.

Engineers across the world are focused on developing new products faster and more efficiently than ever before. The competitive nature of the industry, combined with the technology driving IOT product development, requires engineers to constantly be first to market. In addition, companies are up-revving key products faster than ever before.

These are the needs Advanced Assembly was built from the ground up to meet. We prioritize and embrace custom designs, prototypes and low-volume PCB assembly, which has made us the leader in this market. Our first article service and assembly guarantee are the best in the industry, earning the trust of our many customers.

Advanced Assembly continues to invest in the best equipment and systems from quote to delivery to provide the fastest turn-times to engineers and companies needing prototype to mid-level production PCB assembly. In 2018 we remodel the entire facility, continuing our promise to stay ahead of the curve in technology and customer service.

We are constantly upgrading our automation software to present customers with a "WOW" experience. Advanced Assembly sees continued opportunities in our specific market and is bullish for 2019, expecting sustained growth in electrical product development.
Milan Shah
President, Royal Circuit Solutions, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling