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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

February 15, 2019

Reza Meshgin, CEO, Multek

At Indium Corporation, we believe that materials science changes the world.

As our industry continues to move at a tremendous speed and with no sign that the intensity will decrease--we will navigate by being aware and agile. This is more necessary than ever as we deal with the disruptive impacts of trade wars and other political influences, combined with the pressures of more demanding applications in terms of performance and reliability.

Key global segments in electronics predict a slightly slower growth through the next 2 years, but the intensity will remain.

Our industry needs to be intelligent, cautious, responsive, and agile to predict and respond to these disruptors. We need to continue exploring new methods and investing in our abilities to respond, in many cases, to the unknown or at least the unpredictable.

So in summary: Prepare for the unknown and hold tight, it's going to be a bumpy ride! Best wishes for 2019 folks.

Reza Meshgin, CEO, Multek

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura