circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 2, 2020

Craig Hillman, PhD, ANSYS DfR Solutions

2018 was a landmark year for Multek. We were acquired by our new parent company DSBJ, started a year-long celebration of our 40th anniversary, and received more "green" ratings from the Environmental Protection Bureau (EPB) in Guangzhou, China, than all other PCB companies combined.

Each of these milestones laid the foundations for an even more remarkable 2019. First, our four decades of experience and industry leadership will continue to evolve based on the services and technologies customers want. This include moving beyond the PCB and PCBA to include our latest offering of Box Build.

Our new parent company is also investing new know-how, capabilities and modernization. This includes transferring deeper FPC expertise and upgrading to the latest ERP systems. Finally, Multek's achievements in environmental responsibility are unmatched -- as demonstrated by our recent attainment of three Green EPB ratings -- and will continue to benefit customers who also prioritize compliance and global citizenship. All these investments are already paying dividends and will keep doing so throughout 2019 and beyond.

While I've only recently taken on Multek's CEO role, I can see the excitement, energy, and optimism throughout our entire organization as we enter 2019. The above positive tailwinds will give customers more options, greater efficiency and speed, as well as a greener planet. I look forward to sharing more about these developments with you during the year."
Craig Hillman, PhD
Director, Product Development, ANSYS DfR Solutions
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling