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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 13, 2020

Simon Payne, CEO, XJTAG

The China tariff dispute has not materially affected our USA business but it has improved opportunities for Thermaltronics in India, Philippines & Vietnam, where we have seen increases in development and production, as a way to circumvent tariffs, imposed by the USA, on China.

We are in a technology driven industry, so continuing to be innovative is a key driver in our company philosophy. The award winning solder robots, we have developed, are a testimony to that belief.

Yes, we will continue with new product introductions going forward and as well as making improvements in existing products, to ensure compliance with industry 4.0.

Our market expansion plans are primarily geographic as manufacturers relocate to more productive and low cost environments.

In 2020 we expect growth to be centred around automation and not so much in relation to increases in demand.

Simon Payne
CEO, XJTAG

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura