circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 16, 2020

Sven Frischen-Nocher, COO/Vice President, INGUN USA, Inc.

2020 is lining up to be another strong year for Plasma Etch. We continue to see strong growth in production scale systems.

We are rolling out a new, larger parts cleaning machine, the PE-5000; it’s very versatile with movable shelves! Look for an announcement soon!

Our plasma polymerization systems continue to drive sales and improve our market share as we head into 2020.

We will be demonstrating our industry leading plasma treatment systems at MD&M West and IPC Apex this winter, as well as MD&M East and Semicon West over the summer.

Visit us at a trade show for a free demonstration, and like us on Facebook to keep up to date on our exciting new patented technology.
Sven Frischen-Nocher
COO/Vice President, INGUN USA, Inc.
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling