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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 16, 2020

Lawrence Davis, Founder and CEO, Advanced Assembly

With another record year for INGUN the industry still holds a lot of excitement for the years to come. Especially in the Automotive and Automation sector we will see some critical changes or developments which will have a huge impact in the future, and the world as a whole will be dominated by technology and digitalization. When we think it is already flooded with technology, we are only at the beginning of a new tech-era.

Since INGUN is always very close to its customers and the early stages of NPDs to help develop the best test solution for the new products and technologies, we reformed our vision and make sure that we are the "Partner for Future Technology".

5G is still the focus point for ioT/Smart World technology and we are right in the middle of that all, and provide the best solutions needed to ensure a successful test and quality process.

As the "Partner for Future Technology" we are very excited for the coming year and wish everyone a successful 2020.
Lawrence Davis
Founder and CEO, Advanced Assembly
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling