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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 17, 2020

Chintan Sutaria, CEO and Founder, CalcuQuote

In 2019, we celebrated our 15th year in the ultra-quick-turn PCB fabrication and assembly market. As anticipated, this was another year of record growth for Advanced Assembly. We have an equally bullish expectation for 2020 and are expanding our factory by 5000 square feet to support the assembly speed and volume that our customers expect.

Technology companies must constantly innovate to survive, and that innovation requires a fabrication and assembly partner for prototypes and low-volume production runs.

Advanced Assembly was built from the ground up to put assembled boards back into our customers' hands faster than anyone else. Since prototype production volumes are typically small, and innovation is a product necessity, our business model is relatively unaffected by tariffs and market uncertainty.

We expect components to continue to shrink in package size and that boards will be designed to a tighter density. These trends increase assembly difficulty, but we constantly invest in the latest production equipment and employee training to stay on the leading edge of manufacturing capabilities.

We assemble boards for all industries, including IoT, defense, and medical device manufacturers. As engineers continue to iterate their designs and develop new products, we will be right there with them.
Chintan Sutaria
CEO and Founder, CalcuQuote
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling