circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 21, 2020

Watson Tseng, General Manager, SHENMAO America Inc.

If you don’t measure, you don’t know.

CeTaQ provides 3rd party on-site mobile measurement & equipment solutions for validating quality specification performance. Whether you're an OEM needing to confirm your specs or the end user needing the highest level of accuracy for complex SMT manufacturing, CeTaQ measures it.

Robotic automation work cells got more measurement attention in 2019. A new measurement methodology was developed to validate accuracy of directional robotic arm movement; important as more automation requires more accuracy. This is a new line of quality validation work for CeTaQ’s global service footprint.

In early 2020, CeTaQ will debut our new CmPrint 2.0 Tool as a 2-part printer performance test. Test execution simultaneously measures printing accuracy and squeegee force together during each print stroke. The dynamic measurement highlights quantifiable movement between board and stencil as squeegee pressure increases. Printer manufacturers will not be able to hide from these results. Stable performance and print definition are critical as smaller and more complex products are introduced into high volume SMT manufacturing.

SMT manufacturing continues to benefit from regular equipment validation exercises and companies continue to embrace 6-Sigma methods. Implementing regular Cpk measurement introduces mainstream quality improvement while increased manufacturing efficiency, additional capacity and defect reduction in each process step become intrinsic!

CeTaQ Americas, celebrating 19 years in 2020, will exhibit at IPC APEX Expo in Booth #812.
Watson Tseng
General Manager,, SHENMAO America Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling