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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 21, 2020

Roberto Yebra, Technology and Marketing Specialist, Test Research, Inc.

To reduce the damage from the China tariff, most of the global EMS providers with facilities in China are planning to or already have moved their production to other countries such as Thailand, Vietnam, Taiwan, India and Mexico. Material suppliers who are capable of providing global supply and support, such as SHENMAO, will be benefit from the change.

As a result, SHENMAO is expecting strong growth throughout 2020 as companies will be looking for premier products that are lower in cost without compromising quality.

5G, AI and automotive technologies have set new performance and reliability standards for electronic products. SHENMAO anticipates this trend continuing for the coming year and will introduce more solder materials to help numerous industries make reliable solder joints.

Roberto Yebra
Technology and Marketing Specialist, Test Research, Inc.

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura