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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 22, 2020

Jason Chung, CEO, Ventec International Group

During the past year, Test Research, Inc. (TRI) had a year-long celebration of our 30 years of excellence as the leading one-stop test and inspection solution for the PCB Assembly Industry. TRI proudly announced the development and launch of new models, for example, the industry-leading high-speed TR7600F3D SII 3D AXI, the high accuracy TR7700Q SII 3D AOI, and the award-winning TR7700 SV 3D AOI.

2019 has been a year of growth, development, and change; we have been experiencing the migration of Chinese manufacturing to neighbor countries. The electronics assembly industries will experience the opportunity to embrace and incorporate the new wave of innovative machinery. Along with these changes new business opportunities arise, we are expecting to open new branches in 2020 to satisfy our customers and provide the best service possible.

As for our outlook for 2020, we see an increased demand and interest in Conformal Coating Inspection and MES connectivity of legacy equipment in the electronics assembly industry.

Please come visit us at IPC APEX 2020 in booth No. 1151.
Jason Chung
CEO, Ventec International Group
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling