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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 23, 2020

Victor Hemingway, President, Royal Flex Solutions

Electrolube has seen an exponential increase in growth worldwide this year. In India alone, growth rose by a staggering 91%. In China, we relocated our manufacturing to a vast new facility in Zhuji, occupying 110,00 sq. ft, and expanded our R&D centre in Suzhou by 40%.

In India, we localised a number of key encapsulation resin products, using locally sourced raw materials, to meet the demands of the local market. Our growth in India is colossal and our thermal management range is driving this growth forwards in the EV and LED industries.

In Europe, the shift in automotive to e-mobility is an area where we are leading the way in electronics protection solutions across every stage of design and production. We have launched a number of new coatings, resins and thermal management products to wide acclaim, addressing the key challenges faced by automotive manufacturers for reliability and high performance in harsh environments.

The key to our success has been our leadership in innovation. Our Chinese, UK and Indian R&D departments work very closely, cross-exchanging ideas, which has enabled us to not only create products that meet the needs of local manufacturers, but also solve problems for customers around the world at a pace that is hard to match. With strong demand for our products worldwide, Electrolube has never been stronger.
Victor Hemingway
President, Royal Flex Solutions
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling